[agents] Deadline Extension - 2023 Symposium on Internet of Things (October 25-27, 2023 - São Paulo, Brazil)

Rebeca Campos Motta rcmotta at id.uff.br
Thu Jul 27 10:53:03 EDT 2023


*Call for Papers: *

*2023 Symposium on Internet of Things (2023 SIoT)October 25-27, 2023 (São
Paulo, Brazil)*

The 2023 Symposium on Internet of Things (2023 SIoT) will be held in São
Paulo City, Brazil, from the 25th to the 27th of October, 2023. The theme
of the 2023 SIoT is "IoT for a Sustainable and Connected World". Continuing
the tradition, 2023 SIoT will provide an international technical forum for
experts from industry and academia to exchange ideas and present ongoing
results.

For more information, please visit: https://iotbrasil.org.br/congresso/2023/

*Paper submission guidelines*
We invite two types of submissions: *full papers* and *abstracts for
posters*.

   - *Full Papers* must describe original work and be up to 5 (five)
   two-column and single-spaced pages, including references. Accepted full
   papers will be presented orally by one of the authors (in person or
   virtually).
   - *Abstract for posters *must report complete novel results and can be
   up to 1 (one) two-column and single-spaced page, including references.
   Accepted abstracts for posters will be presented in poster sessions in
   person.

Both categories follow the IEEE conference template. A complete template
(Latex and Word) to prepare your paper is available at
https://www.ieee.org/conferences/publishing/templates.html.

<https://www.ieee.org/conferences/publishing/templates.html.>*Submission
link*: https://cmt3.research.microsoft.com/SIoT2023.

Acceptance of submissions will be based on quality, relevance, and
originality. The official language of the symposium is English. Accepted
papers will be submitted for inclusion into IEEE Xplore subject to meeting
IEEE Xplore’s scope and quality requirements.

*Format:* Both categories follow the IEEE conference template. A complete
template (Latex and Word) to prepare your paper is available at
https://www.ieee.org/conferences/publishing/templates.html.

*Publication: *SIoT has IEEE sponsorship and the proceedings will be
published in IEEE Xplore.

*Blind Review:* During the initial paper submission process via CMT,
authors are responsible for removing any information from their manuscripts
that might lead a reviewer to discern their identities or affiliations,
ensuring a blind review. For this:
- Remove all mentions of the author name(s), institutional affiliations(s),
and sources of funding from the paper (including page headers and footers,
footnotes, and acknowledgments);
- Please avoid phrasing in which you refer to your own previously published
work (for example, “elsewhere I have argued…”). If possible, refer to your
own references in the third person. Avoid citing unpublished manuscripts;
- Check that all identifiers have been removed from electronic files such
as Microsoft Word documents (File → Information → Check for issues →
Inspect Document).

*Important dates - Deadline Extension*

   - *Paper submission:** August 16st, 2023*
   - *Author notification:* *September 25th, 2023*
   - *Camera-Ready deadline:* *October 10th, 2023*

*General Program Chair*
Moisés V. Ribeiro, Universidade Federal de Juiz de Fora, Brazil

*Technical Program Co-Chairs*
Flávia C. Delicato, Universidade Federal Fluminense, Brazil
Cecília de A. C. César, Instituto Tecnológico de Aeronáutica, Brazil

-- 
Atenciosamente,
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://lists.cs.umbc.edu/pipermail/agents/attachments/20230727/e3c51adb/attachment.html>


More information about the agents mailing list