[agents] Springer(LNCS):15th International Symposium on Software Engineering Processes and Applications

[Sanjay Misra]

*Highlights:* SEPA covers applications of AI and computations techniques in
any area,  Publication in the most reputed series of Springer(LNCS), has
low registration(*180€*) for online presentations, and is indexed in CORE,
SCOPUS, and Web of Science

SEPA 2023: 15th International Symposium Software Engineering Processes and
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Link: https://sites.google.com/view/ssepa/home

When Jul 3, 2023 - Jul 6, 2023
Where Athens, Greece
Submission Deadline Mar 26, 2023
Notification Due Apr 16, 2023
Final Version Due May 7, 2023
*Categories* <http://www.wikicfp.com/cfp/allcat>    software applications
<http://www.wikicfp.com/cfp/call?conference=software%20applications>
artificial
intelligence
<http://www.wikicfp.com/cfp/call?conference=artificial%20intelligence>
  advanced
applications
<http://www.wikicfp.com/cfp/call?conference=advanced%20applications>   software
engineering
<http://www.wikicfp.com/cfp/call?conference=software%20engineering>


Call For Papers

SEPA 2023: 15th International Symposium on Software Engineering Processes
and Applications
Publisher- Springer LNCS, Special issues- in Several SCIE/SCOPUS Indexed
Journal

The conference is planned to be organized in Blended form (physical
presentation and online presentations).

The accepted papers will be published in Lecture Notes in Computer Science
by Springer
https://sites.google.com/view/ssepa/home
http://www.iccsa.org/workshops

Following the grand success of SEPA 2022(Malaga, Spain), SEPA 2021(BLENDED
MODE) and SEPA 2020(Online), SEPA 2019 (in Saint Petersburg, Russia), SEPA
2018(In Melbourne, Australia), SEPA 2017(in Trieste, Italy), SEPA 2016 (in
Beijing, China), SEPA 2015 (in Banff, Canada), SEPA 2014 (in Guimaraes,
Portugal), SEPA 2013 (in Ho Chi Ming, Vietnam), SEPA 2012 (in Salvador,
Brazil), SEPA 2011 (in Santander, Spain), SEPA 2010 (in Fukuoka, Japan),
SEPA 2009 (in Sowon, Korea), SEPA 2022 (in conjunction with ICCSA 2022) is
scheduled to be held during July 3 - 6, 2023 in collaboration with the
National Technical University of Athens and the University of the Aegean,
Athens, Greece.

Submission deadline: March 26, 2023

About the Workshop and Topics

Software Engineering Processes and Applications (SEPA: 2023) is aimed to
provide a forum to scientists/researchers/engineers/practitioners and
academicians to share their ideas, experiences, and research in the field
of software engineering processes and applications. SEPA 2023 covers all
the frontier issues and trends in modern software
development processes. It includes process models, the development
processes for different software platforms (e.g., social networks, cloud),
a process for adaptive, dependable, embedded systems, agile development,
software engineering practices, requirements, system, and design
engineering including architectural design, component-level design, formal
methods, software modeling, testing strategies and tactics, process and
product metrics, Web Engineering, project management, risk management, and
configuration management. SEPA also invites papers for the development
process of the software/software systems in application areas e.g.
agriculture, aviation industry,
business, cyber-crime, education, government, military, etc.

SEPA invites you to submit theme papers that describe original and
significant contributions in all the above-mentioned areas of software
engineering processes. The paper submitted to SEPA 2023 must not be
submitted elsewhere, either in a conference or journal, and should be 12 -
16 pages (LNCS style). Papers selected after peer review will be included
in the Lecture Notes in Computer Science published by Springer (only after
completing the registration)
and presented online.

Publication

All contributions will be reviewed by international program committee
members and judged on their quality and relevance. The accepted papers for
SEPA 2023 will be published in Lecture Notes in Computer Science as a book
series of Computational Science and Its Applications: ICCSA. Please note
that one of the authors of the accepted
paper should be registered and supposed to present the paper at the
conference (virtual presentation is allowed for authors who cannot attend
the conference). The extended version of selected papers will also be
invited for publication in several journals (All Web of Science and
SCOPUS-indexed journals), including the best papers
in SCIE-indexed journals*.

*Special issues In SCIE Journals- Information Technology And Controls,
Applied Science, Electronics are confirmed for best papers of the software
engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023).
https://www.mdpi.com/topics/Software_Engineering_Applications

Submission

Please submit your paper through ICCSA 2023 conference website.
Submission site: http://ess.iccsa.org/cgi-bin/login.py

while submitting to the conference site, please select the track of your
submission, "15th International Symposium on Software Engineering Processes
and Applications (SEPA 2023)".

Important Dates:
March 26, 2023: Deadline for abstract and paper submission
April 16, 2023: Notification of Acceptance
May 7, 2023: Submission deadline for the final version of the Proceeding
Paper (hard deadline)
May 7, 2023: Registration ends (hard deadline).
July 3-6, 2023: SEPA at ICCSA 2023 Conference in Athens, Greece

International Program Committee

Organizing Chair (Contact)

Sanjay Misra
Department of Computer Science and Communication
Østfold University College, Halden, Norway
ssopam at gmail.com

Programme Committee Chair

Robertas Damasevicius
Department of Software Engineering
Kaunas University of Technology, Kaunas, Lithuania
robertas.damasevicius at ktu.lt


International Programme Committee Members

Raj Kumar Buyya, University of Melbourne, Australia
Mario Fusani, National Research Council of Italy
Daniel Rodríguez, University of Alcalá, Spain
Robertas Damasevicius, Kaunas University of Technology, Lithuania
Reda Alhajj, University of Calgary, Canada
Emilia Mendes, Blekinge Institute of Technology, Sweden
Vahid Garousi, Queen's University Belfast, UK
Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV,
Chile
Michel dos Santos Soares, Federal University of Sergipe, Brazil
V. B. Singh, JNU, Delhi, India
José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico
Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile
Eduardo Guerra, National Institute of space research, Sao Jose, Brazil
Murat Koyuncu, Atilim University, Turkey
Rytis Maskeliunas, Kaunas University of Technology, Lithuania
Tolga Pustali, Cankaya University, Turkey
Matthew O. Adigun, University of Zululand, South Africa
Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain
Ibrahim Akman, Atilim University, Ankara, Turkey
Marco Crasso, UNICEN University, Argentina
Markus Holopainen, University of Helsinki, Finland
Takashi Michikawa, Research Center for Advanced Science and Technology
(RCAST), Japan
Cristian Mateos, UNICEN University, Argentina
Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam
Alejandro Zunino, UNICEN University, Argentina
Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil
Ravin Ahuja, University Of Delhi, India
Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India
Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas,
Colombia
Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea
Adewole Adewumi, Algonquin College, Canada
Matthew Adigun, University of Zululand, South Africa
Luis Fernandez Sanz, Universidad de Alcala, Spain
Ayush Dogra, CSIR-CSIO, Chandigarh, India
Ayan Chatterjee, Simula Research Laboratory, Norway
Hasan Ogul, Østfold University, Halden, Norway
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